Apply toIC、Diode、Transistor、Glass、LED、QFN、PCBIn the same industry, this product is suitable for the cutting process before cutting in the semiconductor wafer cutting process.
Main features:
☑ No bubble rapid film sticker;
☑ The film machine table do antistatic Teflon treatment can protect the chip, convenient replacement of the panel;
☑ The roller system adjusts its height according to the different thickness of the product in order to prevent the product from breaking.
☑ Equipment marking system;
☑ The equipment involves different fields, and can be designed according to the products of different fields.
